Abstract
In this study, contact corrosion of Ni-Cr alloy soldered by gold and silver solder was investigated. After being soldered, Ni-Cr alloys were immersed in physiological saline solution for 100 days. A detailed observation was made of the surface of the soldered alloy and the interface between Ni-Cr alloy and solder, using an optical microscope. In addition, distribution of alloy elements in Ni-Cr alloy-solder interface and strength of the soldered joint were examined.The following results were obtained.1. In case of soldering by gold solder, no corrosion occured at the soldered joint.2. In case of soldering by silver solder, corrosion occured at Ni-Cr alloy-solder interface, and the solder became porous.3. Pitting occured only at the surface of Ni-Cr alloys containing less than 19% Cr.4. At Ni-Cr alloy-gold solder interface, a thin layer which might be caused by alloying with each other was observed using an optical microscope and EPMA. Tensile testing confirmed that the soldered joint between Ni-Cr alloy and gold solder was stronger than a layer of gold solder.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.