Abstract

In order to support continuous growth of global IP traffic, highly energy-efficient networks are demanded. One of the key components is an optical multicast switch which has large bandwidth with small power consumption. When using multicast switches, however, intrinsic losses will be an issue especially for large port count switches. Erbium doped fiber amplifiers (EDFAs) are typically used for the loss compensation, although it would much increase the number of components and footprint of the system. One of the options to solve this problem would be an integration technology of semiconductor optical amplifiers (SOAs) on the silicon photonics switches which we have recently developed. In the previous work, we have demonstrated a gain-integrated 4 × 4 silicon matrix switch. For the practical use of our technology, it is very important to show further scalability of the platform. Moreover, it is also important to show applicability to other switch topologies, such as multicast switches. In this article, we demonstrate an 8 × 8 silicon photonics multicast switch with on-chip integrated 2 × 4-ch. SOAs. The on-chip SOAs exhibit a net gain of ∼9 dB, which almost compensates for the intrinsic loss. We observe the crosstalk of less than −35 dB. Loss/crosstalk reduction and chip power consumption are also discussed.

Highlights

  • O PTICAL multicast switches (MCS) are gaining much attentions as key devices for advanced telecom/datacomManuscript received November 18, 2019; revised February 17, 2020; accepted March 14, 2020

  • We believe that hybrid integration of semiconductor optical amplifiers (SOAs) on a silicon photonics TO MCS is a promising way because they can compensate for the intrinsic loss with small footprints

  • We believe that our results prove the scalability of the platform because multiple SOA chips can be simultaneously integrated on the same silicon photonics switch chip to increase the port count

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Summary

INTRODUCTION

O PTICAL multicast switches (MCS) are gaining much attentions as key devices for advanced telecom/datacom. We believe that hybrid integration of SOAs on a silicon photonics TO MCS is a promising way because they can compensate for the intrinsic loss with small footprints. We believe that our results prove the scalability of the platform because multiple SOA chips can be simultaneously integrated on the same silicon photonics switch chip to increase the port count. 2(d) shows the measured on-chip transmittance as a function of the TEC temperature, where the input power to the chip was fixed to −10 dBm and the SOA current was fixed to 80 mA. We consider that reducing input coupling loss (between fiber/chip and/or silicon/SOA) would improve the device NF. The coupling loss between PMF and the silicon waveguide was ∼2.9 dB/facet

ASE Spectra and Operating Point
Net Gain Spectra
Crosstalk
Loss Reduction
Crosstalk Reduction
Considerations for WDM Transmission
Power Consumption
CONCLUSION
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