Abstract
A novel packaging technology using a multi-layer Tape Automated Bonding (TAB) tape was developed for a GaAs multi-chip module to be employed in radio units of mobile telephones. The microwave properties of the multi-layer TAB tape were first evaluated using a ring resonator and a through-line. Then, the TAB tape was applied to a 900 MHz-band high power amplifier. It consists of two MMIC chips and an output matching circuit formed on the TAB tape. The amplifier module delivered a saturated output power of 31.6 dBm with a power added efficiency of 54.9% at 933 MHz with a supply voltage Vdd of 3.3 V. These results suggest that the TAB tape assembly has a high potentiality for realizing a thin and light weight RF unit in mobile communication terminals with low cost.
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