Abstract

Gallium (Ga) and some of its alloys have a range of properties that make them an attractive option for microelectronic interconnects, including low melting point, non-toxicity, and the ability to wet without fluxing most materials—including oxides—found in microelectronics. Some of these properties result from their ability to form stable high melting temperature solid solutions and intermetallic compounds with other metals, such as copper, nickel, and aluminium. Ga and Ga-based alloys have already received significant attention in the scientific literature given their potential for use in the liquid state. Their potential for enabling the miniaturisation and deformability of microelectronic devices has also been demonstrated. The low process temperatures, made possible by their low melting points, produce significant energy savings. However, there are still some issues that need to be addressed before their potential can be fully realised. Characterising Ga and Ga-based alloys, and their reactions with materials commonly used in the microelectronic industry, are thus a priority for the electronics industry. This review provides a summary of research related to the applications and characterisation of Ga-based alloys. If the potential of Ga-based alloys for low temperature bonding in microelectronics manufacturing is to be realised, more work needs to be done on their interactions with the wide range of substrate materials now being used in electronic circuitry.

Highlights

  • A noteworthy trend is being observed with microelectronic products becoming smaller and more energy efficient [1,2], and performing well while having minimal impact on human health and the environment [3]

  • This review provides a summary of research related to the characterisation of Ga-based alloys and their applications in microelectronics

  • The most attractive properties of Ga and Ga-based alloys arise from their combination of thermal and electrical conductivity, with fluidity at low temperatures or even at room temperature

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Summary

Introduction

A noteworthy trend is being observed with microelectronic products becoming smaller and more energy efficient [1,2], and performing well while having minimal impact on human health and the environment [3] Both academic and industrial interest has been expressed in flexible or deformable electronics. Alloys that are liquid at room temperature or that have a low melting point have the potential to create unique combinations of electrical and thermal conductivity They offer the additional benefit of enabling the production of flexible electronic circuitry. Much research has been completed on the microelectronic components and circuit innovations that use liquid metals, and the efforts are continuing These alloys have the potential of enabling electronic assembly at lower process temperatures than those required by conventional alloys. This review provides a summary of research related to the characterisation of Ga-based alloys and their applications in microelectronics

Properties of Ga and Ga-Based Alloys
Soldering
Low-temperature
Heat-Free
Characterisation of Reactions between Liquid Ga-Based Alloys and Solid Metals
Microstructure Development between Liquid Ga-Based Alloy and Solid Materials
Liquid Ga-Based Alloy Reactions with Metal Powder
Reactions between Liquid Ga-Based Alloys and Cu Substrates
Schematic
10. Microstructure
Reactions between Liquid Ga-Based Alloys and Other Substrates
Wettability
Wetting Characteristics of Liquid Ga and Ga-Based Alloys
Effect of Liquid-Solid Interaction on Wettability
Findings
Summary

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