Abstract
In late years heat generation per a unit area of electronic devices such as CPU's increases, and efficient cooling technology has been required. In this study the authors investigated combination of impinging flow cooling and boiling heat transfer cooling inside mini channels. The impinging flow was realized by making T-junction structure with polyetheretherketone (PEEK). The authors performed observation of boiling bubbles inside mini channel and compared heat transfer characteristic for simple parallel flow channel and impinging flow channel. The flow channel has a square cross section, and one side of the channel was 3.0 mm in width. Transparent glasses were installed for flow and bubble observation. It was found from the experimental results that the impinging flow of T-junction showed different behavior about separation of boiling bubbles and gave higher cooling ability and lower thermal resistance.
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