Abstract
Adhesive bonding is now widely used in manufacturing portable electronic devices such as mobile phones. Recently, with the aim of improving efficiency of its manufacturing process, pressure sensitive adhesives (PSA) for the joints are taken notice instead of liquid adhesives. However, the strength of PSA bonded joint, especially under impact loading, has not been understood enough yet. The main scope of this study is to research the strength of PSA bonded joint under various loading rates. In these experiments, stress distribution in specimens is visualized using high speed polarization camera. These experimental results show that although the fracture toughness of PSA bonded joint increases with respect to loading velocity in slower rate range, it decreases in higher loading rate range because PSA becomes more brittle.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
More From: The Proceedings of Mechanical Engineering Congress, Japan
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.