Abstract
This paper introduces a fuzzy analytical model for the optimal component placement of the power dissipating chips on a multichip module substrate. Our methodology considers multiobjective component placement based on thermal reliability as well as routing length criteria. The objective of the coupled placement methodology is to enhance the performance and reliability of the multichip module system by obtaining an optimal cost during multichip module placement. Case studies of the coupled placement are presented. In addition, the thermal distribution of the coupled placement results is simulated using the finite element method.
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