Abstract
The effects and implications of current developments in interconnection technology on print and fire thick film hybrid manufacture are discussed. Particular emphasis is given to the fact that in many cases new techniques complement rather than compete with film hybrids. Alternative substrates, semiconductor packaging, semicustom integrated circuits, surface mount technology and polymer thick film are all included in the paper. Conclusions are drawn which indicate that although these technologies are all of crucial importance they will not replace current thick film technology.
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