Further Cooling Improvement by Use of Chamfers in Front/top of Electronic Components

Abstract

This paper presents a Computational Fluid Dynamic computation based on Reynolds Averaged Navier-Stokes Equations (RANS) and the Shear Stress Transport (SST) turbulence model. The targeted application is the cooling process of an electronic component, which is represented by a heated wall-mounted cube exposed to an impinging jet in cross flow. In a previously published study, it was shown that adding chamfers on top of the cube, the flow structure is radically changed in favor of a significant improvement in cooling efficiency. In an attempt to determine which of the four faces has the greatest contribution to improving cooling, this study presents a detailed numerical investigation for five different cases. Namely, a base cube without chamfer, a cube with four chamfers on its upper part, a cube with a chamfer on the front face, a cube with chamfer on the back face and finally a cube with chamfers on the side faces. For the same ReH = 3410 cross-flow Reynolds number, three levels of incident jets are tested as well as a jet-free case, which will serve as a reference case for comparison. Comparing the different cases, it has been found that the case of a chamfer on the front face is the most efficient and therefore contributes effectively to the improvement of the cooling efficiency