Abstract

Mask registration control is one of the key performance specifications during the mask qualification process. It is becoming an important factor for yield improvement with the continuously tightening registration specs driven by tight wafer overlay specs. Understanding the impact of miss classified masks on the final wafer yield is gaining more and more attention, especially with the appearance of Multiple Patterning Technologies, where mask to mask overlay effect on wafer is heavily influenced by mask registration. ZEISS has established a promising closed loop solution implemented in the mask house, where the PROVE® system – a highly accurate mask registration and overlay metrology measurement tool, is being used to feed the RegC® - a registration and mask to mask overlay correction tool that can also accurately predict the correction potential in advance. The well-established RegC® process typically reaches 40-70% improvement of the mask registration/overlay error standard deviation. The PROVE® - RegC® closed loop solution has several advantages over alternative registration control methods apart of the mask re-write saving. Among the advantages is the capability to correct for pellicle mounting registration effects without the need to remove the pellicle. This paper will demonstrate improved method for enhanced mask to mask overlay control based on a new scheme of data acquisition and performance validation by the PROVE®. The mask registration data as well as additional mask information will be used to feed the RegC® correction process. Significantly improved mask to mask overlay correction results will be discussed and presented in details.

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