Abstract
The influence of the presence of grain boundaries on the rates of sintering of nickel, copper and iron wire wound compacts was studied. In iron compacts sintered in the alpha range, surface diffusion appears predominant and no grain boundary effect is therefore expected or evident. On the other hand, sintering of copper and of nickel compacts at temperatures close to their respective melting points apparently occurs by volume diffusion but with varying grain boundary effects. Neck growth in both materials appears entirely unaffected by the presence or absence of grain boundaries. Void shrinkage was found to be sharply inhibited in nickel samples from which grain boundaries had been deliberately eliminated, but no definite effect was noticed in copper, in apparent contradiction to previous results. (auth)
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