Fundamentals of Residual Stresses in Joints Between Dissimilar Materials

Abstract

When a discontinuity in material properties exists across a bonded interface, stresses are generated as a result of any thermal or mechanical loading. These stresses significantly affect strength and failure characteristics and may be large enough to prevent successful fabrication of a reliable joint. The use of an interlayer material to successfully reduce mismatch stresses, thereby preventing joint failure or improving joint strength and reliability, requires knowledge of failure mechanisms and of the effects of interlayer properties on the critical stress components.The origin of residual stresses developed during cooling of a ceramic-metal joint from an elevated fabrication temperature is illustrated qualitatively in Figure 1. Away from edges, the in-plane (parallel to interface) stresses are typically compressive in the ceramic and tensile in the metal. These stresses can cause cracking perpendicular to the interface, leading to spalling or delamination failures. Such failures are frequently observed in thin-film and coating geometries. Where the interface intersects a free edge, large shear and axial (perpendicular to the interface) stresses are generated. The edge stresses are typically tensile within the ceramic and tend to promote crack propagation within the ceramic parallel and adjacent to the interface. This is the most commonly observed failure mode in bonded structural components.