Abstract
High power pulsed magnetron sputtering (HPPMS) has attracted a great deal of interest because of its potential to provide a highly ionized flux of target material to the substrate. However, practical experience with HPPMS has shown deposition rates typically lower than direct current sputtering (DC sputtering) rates at the same average power, and ionization fractions of target material flux to the substrate often lower than anticipated. A mathematical model explaining the source of these observed process characteristics has been proposed by the author previously. Here, a graphical means of visualizing the mechanism for deposition rate reduction and lower than expected ionization fractions is presented.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
