Abstract
During the past six years comprehensive research programs have been conducted at the Beijing Polytechnic University to provide a better understanding of heat transfer characteristics of existing and condidate cooling techniques for electronic and microelectronic devices. This paper provides a review and summary of the programs with emphasis on direct liquid cooling. Included in this review are the heat transfer investigations related to the following cooling modes: liquid free, mixed and forced convection, liquid jet impingement, flowing liquid film cooling, pool boiling, spray cooling, foreign gas jet impingement in liquid pool, and forced convection air-cooling.
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