Fundamental Micro-Grooving Characteristics of Hard and Brittle Materials with a Fine Wire Tool

Abstract

Thinning of the silicon wafers and decrease in kerf loss can minimize the production costs of semiconductor products. Currently, the quantity of kerf loss is about the same as the volume of the wafer itself. If we drastically reduce kerf loss, we can easily lower production costs. Therefore, we studied techniques for slicing silicon wafers with reduced kerf loss using a wire tool. As a first step, we performed micro-grooving with a fine wire tool. In this paper, we discuss the micro-grooving performance of a fine wire tool made of tungsten. A borosilicate glass is used as the work material. The main conclusions are as follows: When a fine wire tool and small-diameter abrasives are used, the kerf loss decreases. However, the strength of fine wire tools is very low. The relative velocity and abrasive diameters have a significant influence on the micro-grooving characteristics. Fine wire tools are easily fractured at fast relative velocities and with large-diameter abrasives. However, the grooving rate increases. Groove depth and grooving efficiency do not depend on the relative velocity and are dependent on the abrasive diameter.