Abstract
AbstractTo meet the high requirements for polyimide (PI) manufacturing process without sacrificing material performance, a new type fabrication method for PI is proposed here. Based on the classical Kapton system, functionalized precursor polyamide acid (MPAA) resin solution with high solid content, low viscosity and high relative molecular weight was obtained via mercaptoacetic acid locking imine (MALI) reaction, and a series of linear Mali‐Polyimide (MPI) films were prepared and their properties were well investigated. The results showed that MPIs have relatively excellent thermal stability (Td5%: 598 ~ 601°C), good heat resistance (Tg: 277 ~ 278 °C) and high adhesion strength. This work emphasizes the possibility and potential of MALI reaction in PI synthesis and is expected to be applied in coating and adhesive field.
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