Abstract
This work presents a method to assess the reliability of integrated inductors on a flexible substrate through a functional cyclic bending test, which consists of a full characterization of these inductors after several bending cycles. Inductors were fabricated through a simple and original technology suitable for use in the heterogeneous integration of radiofrequency and microwave applications. Failure analysis before and after tests have not found any problem related to the use of a flexible substrate. Less than 15 % of the tested inductors failed after the bending tests, indicating the good performance of the fabrication process and a robust method to evaluate the reliability of such components.
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