Fully Connected Convolutional Neural Network in PCB Soldering Point Inspection

Abstract

In Electronics Manufacturing Services (EMS) industry, Printed Circuit Board (PCB) inspection is tricky and hard, especially for soldering point inspection due to the extremely tiny size and inconsistent appearance for uneven heating in reflow soldering process. Conventional computer vision technique based on OpenCV or Halcon usually cause false positive call for originally good soldering point on PCB because OpenCV or Halcon use the pre-defined threshold in color proportion for deciding whether the specific soldering point is OK or NG (not good). However, soldering point forms are various after heating in reflow soldering process. This paper puts forward a VGG structure deep convolutional neural network, which is named SolderNet for processing soldering point after reflow heating process to effectively inspect soldering point status, reduce omission rate and error rate, and increase first pass rate. SolderNet consists of 11 hidden convolution layers and 3 densely connected layers. Accuracy reports are divided into OK point recognition and NG point recognition. For OK soldering point recognition, 92% is achieved. For NG soldering point recognition, 99% is achieved. The dataset is collected from KAGA Co. Ltd Plant in Suzhou. First pass rate at KAGA plant is increased from 25% to 80% in general.