Abstract
The atomic layer deposition (ALD) technique has been extensively utilized for depositing metal oxide (MO) thin films, particularly as gate insulators in thin film transistors (TFTs). However, research on MO semiconductors as channel layer materials in TFTs using ALD is limited, especially for fully ALD-fabricated MO TFTs. In this study, fully ALD-fabricated InAlO TFTs were developed, with optimized aluminum doping content and annealing temperature to enhance the electrical properties and stability. The InAlO TFTs, fabricated with a cycle ratio of 15:1 and annealed at 350 °C, exhibit superior performance, including a field-effect mobility of 7.2 cm2/V·s, a subthreshold swing of 165 mV/decade, and an on/off current ratio of 2.3 × 106, with a threshold voltage of only 0.1 V. Additionally, they demonstrated good stability, with a threshold voltage shift of 0.11 V under positive bias stress. The improved electrical properties and stability are attributed to reduced carrier concentration and the inhibition of oxygen defect generation, achieved through appropriate annealing temperatures and aluminum doping. Thus, the development of fully ALD-fabricated high-performance TFTs holds promise for next-generation display technologies as pixel-driving circuits.
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