Abstract
The process of repair of structures by using bonded composite patch is an effective and economical method to increase the service life of damaged structures. In this study, the finite element method is used to analyze the behavior of a crack repaired by a circular patch by computing the stress intensity factor (SIF) at the crack tip with and without the disbond. The obtained results show that the boron/epoxy 0° fiber perpendicular to the crack, considerably influences the reduction of the SIF with regard to the boron/epoxy 0° fiber oriented in the parallel direction to the crack. Moreover, the increase of the disbond area amplifies the SIF of the repaired crack and the rate of this increase strongly depends on the disbond area. When the disbond is significant between the patch and the plate, it reduces the repair effectiveness and the crack growth under loading becomes important. The disbond growth results in patch separation.
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