Abstract
In part 1 of the current study of haptic displays, a finite element (FE) model of a finger exploring a plate vibrating out-of-plane at ultrasonic frequencies was developed as well as a spring-frictional slider model. It was concluded that the reduction in friction induced by the vibrations could be ascribed to ratchet mechanism as a result of intermittent contact. The relative reduction in friction calculated using the FE model could be superimposed onto an exponential function of a dimensionless group defined from relevant parameters. The current paper presents measurements of the reduction in friction, involving real and artificial fingertips, as a function of the vibrational amplitude and frequency, the applied normal force and the exploration velocity. The results are reasonably similar to the calculated FE values and also could be superimposed using the exponential function provided that the intermittent contact was sufficiently well developed, which for the frequencies examined correspond to a minimum vibrational amplitude of ∼1 µm P-P. It was observed that the reduction in friction depends on the exploration velocity and is independent of the applied normal force and ambient air pressure, which is not consistent with the squeeze film mechanism. However, the modelling did not incorporate the influence of air and the effect of ambient pressure was measured under a limited range of conditions, Thus squeeze film levitation may be synergistic with the mechanical interaction.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.