Abstract
This paper develops impedance spectroscopy for characterizing transient heat transfer in assembled power semiconductor converter systems. The method addresses limits associated with traditional methods, for e.g., data sheet transient thermal impedance curves are step responses that only characterize the junction-to-case spatial-domain segment. The presented method utilizes an actively switching semiconductor as a controlled modulator of dynamic loss (heat) injections, along with multiple temperature measurements, to form spatial electrothermal impedance frequency response function (FRF) models. Complementary investigations of numerical and analytical modeling methods yield a general, compact thermal model template, for interpreting measured FRFs. A pulsewidth modulated power converter with integrated die and heat sink temperature sensing was characterized with the spectroscopy method. Obtained ambient-referred and relative FRFs describe transient heat transfer, including fast (die-level) and slow (sink-level) modes, over frequency decades with coherence. The FRFs were parameterized and interpreted using the derived compact thermal model.
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