Abstract
This paper describes an integrated-circuit package antenna (ICPA) designed and fabricated using low-temperature cofired ceramic (LTCC) technology for wireless transceivers. The ICPA features a shorting via for frequency-band selection. The measured results show that the prototype ICPA with a size of 17 × 17 × 2 mm3 operates at 5.37 GHz when the via is shorted to ground and at 5.67 GHz when the via is opened. The radiation patterns of the ICPA for both cases are similar to those of a conventional microstrip patch antenna on a small ground plane. © 2005 Wiley Periodicals, Inc. Microwave Opt Technol Lett 44: 439–441, 2005; Published online in Wiley InterScience (www.interscience.wiley.com). DOI 10.1002/mop.20660
Sign-in/Register to access full text options 
Free) 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a call
