Abstract
The purpose of this study is to examine the size effect of a singular stress field on the fracture toughness at the nanometer scale. The cracking behavior is investigated using small single-crystal silicon specimens with different precrack lengths where the size of the singular stress field, ΛK, near the crack tip is 23–58nm. The fracture toughness, KIC, is approximately 1MPam1/2 in all of the specimens, which is in good agreement with that of the macroscale (bulk) counterpart. This clearly indicates that the fracture toughness is independent of size while it was reported that the tensile strength without a crack showed strong dependence at the nanometer scale.
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