Abstract

ABSTRACTA new test approach is presented to measure the fracture toughness of thin films. The polysilicon specimen is a center-cracked panel that is 3.5 μm thick and 3 mm wide with a 100 μm long slot in the center. It is subjected to tensile loading, and the crack-opening displacement is measured by interferometry. The average toughness is 1.4 ± 0.65 MPa-m1/2.

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