Abstract
Au surface finishing on Ni layer in solder joints can lead to the replacement of β-Sn by (Au, Ni)Sn4 phase in microbumps. A thorough crack in (Au, Ni)Sn4 is found after the sample being annealed at 150°C for 1000h. Phase transformation of (Au, Ni)Sn4 to Ni3Sn4 and AuNi2Sn4 is observed. This transformation will lead to −10.5% volume shrinkage and may result in tensile stress, which becomes the reason for a thorough crack formation. Kirkendall voids have been found at the interface between Ni3Sn4 and electroplated Ni layer. Marker movement indicates that there was a dominant Ni diffusing flux.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
