Abstract
The effect of various processing parameters on the strength of brass/Sn-Pb-Sb solder joints containing 0–10% Sb have been determined and the fracture mechanism examined by microscopical techniques. Soldering times up to 1 h at 300° C caused the greatest decrease in the strength of joints with solder containing 3% Sb. After 1 h joints with solders containing 0, 3, 5 and 10% Sb all had a similar strength. Cooling rates after soldering (from water quenching to furnace cooling) and joint gap thickness (from 0.05 to 0.20mm) had a negligible effect on joint strength. Fracture occurs through a region of high porosity in the solder at the brass/ solder interface. The presence of Sb and/or cuboids of SnSb in the solder increases the number and size of the pores and the cuboids tend to physically locate the pores at the interface.
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