Abstract
To investigate the crack growth and crack arrest behaviour of primary circuit materials large scale experiments were conducted on component-like specimens under pressurized thermal shock loading at MPA Stuttgart. The material characteristics varied from high tough material to low tough material with higher nil ductility transition temperature to simulate EOL or beyond EOL-state. All tests started from in-service conditions and were cooled down to room temperature. The specimens showed both stable and unstable crack growth and partly crack arrest. The crack growth behaviour was verified by post test calculations and could be explained with the help of the multiaxiality of the stress state.
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