Fracture in Microscale SU-8 Polymer Thin Films

Abstract

In this work, the fracture of spin coated SU-8 epoxy thin films was investigated under mode I loading using in situ optical experiments on specimens with double edge notched tensile geometry. A method was developed to fabricate 3 μm thick SU-8 films with tapered Chevron type notches using a combination of electron beam and ultra-violet lithography techniques. Subsequently, through speckle patterning under tensile loading, the local deformation fields around the crack tip were extracted using digital image correlation. Since the notches were tapered through the thickness, a crack nucleated from them and grew stably until it spanned the entire thickness before propagating unstably leading to catastrophic failure. As SU-8 underwent brittle fracture with no evidence of a large process zone, the critical energy release rate, JIC was computed from deformation fields, and was found to be 106.6 ± 12.03 J /m2. As the film thickness was small compared to lateral dimensions, assuming plane stress conditions, the critical stress intensity factor was calculated as 0.57 ± 0.03 MPa\(\sqrt {m}\). Furthermore, to assess the validity of the experimental method, a finite element simulation on the exact specimen geometry was conducted with experimentally evaluated far field displacement boundary conditions. The strain fields and J-integral value obtained from the simulation were in good agreement with the experimental results, implying the validity of the in situ experimental method proposed given the challenges of small scale specimens. Furthermore, using fractography and optical imaging it was confirmed that the unstable crack propagation started once the crack front reached full thickness, thereby providing sharp crack at the time of failure, which is necessary for brittle materials for valid fracture toughness experiment. It is expected that the proposed methods of specimen preparation and fracture experiments on microscale polymer thin films can be used on other materials.