Abstract
The mechanical behavior, underlying fracture mechanism and constitutive relations of Sn-3.0Ag-0.5Cu (SAC305) solder alloy at cryogenic temperature through in-situ uniaxial tensile experiments were investigated over a wide temperature range of 293 K–77 K. The activation of deformation twin in the solder alloy contributes to improve the tensile strength and quasi-static toughness, and maintains the fracture elongation at 35–45% with the decline of ambient temperature. SAC305 solder alloy with a mixed mode of ductile and brittle fracture achieves the optimal balance of strength, ductility and toughness at 123 K, and the large mismatch between twins thickening rate (∼13 μm/s) and dislocation slip velocity (∼3.6 μm/s) finally leads to the brittle fracture at 77 K. In addition, Anand model as a unified viscoplastic constitutive law has been employed to describe the constitutive relations of SAC305 solder alloy and fails in fitting the stress-strain curves at invalid temperature below 233 K. Hollomon equation is conducted to perfectly characterize the constitutive relations of the alloy at temperatures lower than 233 K. The method for controlling the formation of deformation twins in the solder alloy and solder joints is really beneficial to solve the reliability problems for cryogenic electronics.
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