Abstract

Coating often plays a role in monitoring and protecting substrates in engineering applications. Interface cracks between the coating and the substrate can lead to crack growth under the action of external loading and will cause device failure. In this paper, the behavior of a fine-grained piezoelectric coating/substrate with a Griffith interface crack under steady-state thermal loading is studied. The temperature field, displacement field, and electric field of the coupling of thermal and electromechanical problems are constructed via integral transformation and the principle of superposition. Thus, problems are transformed into a system of singular integral equations, and the expressions of thermal intensity factor, thermal stress intensity factor, and electric displacement intensity factor are obtained. We used a numerical calculation and a system of singular equations to obtain the relationship of strength factor with material parameters, coating thickness, and crack size.

Highlights

  • Piezoelectric materials have played an important role in the production of intelligent structures

  • Wang and Noda [13] studied the problems of the piezoelectric material strip with a Griffith interface crack under thermal loading and discussed the effects of polarization direction, crack size, and location on the thermal strength factor

  • Considering that the solution of the singular integral equation will use Chebychev polynomials which are defined in the interval [−1, 1], we introduce the following normalized quantities: r= x, l s= t, ð84Þ

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Summary

Introduction

Piezoelectric materials have played an important role in the production of intelligent structures. Piezoelectric composites are prone to cracks at the interface during the process of fabricating defects and load conditions This can even lead to structural failure. Qin and Mai [10] analyzed the interface crack problem of a piezoelectric bimaterial subjected to combined thermal, mechanical, and electrical loads via Stroh’s formalism and the singular integral equation method. Wang and Noda [13] studied the problems of the piezoelectric material strip with a Griffith interface crack under thermal loading and discussed the effects of polarization direction, crack size, and location on the thermal strength factor. Li et al [16] presented a semianalytical technique to solve fracture behaviors of piezoelectric composites under thermal loading This method could analytically represent the resulting stress and electric displacement distribution along the radial direction obtained. The results indicate that the larger elastic modulus and thinner coating thickness improve the safety of the coating/substrate structure

Problem Formulation
Solution to the Problem
Numerical Process and Discussion
Conclusions

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