Abstract
The phenomena occurring during rapid crack propagation in brittle single crystals were studied by cleaving silicon specimens on the low energy cleavage planes under tensile and bending. The experiments revealed new phenomena not previously reported, and new crack path instabilities in particular. The well defined boundary conditions of the tested specimens and crack velocity measurements enabled rationalization of the observed phenomena and the velocity-surface instabilities relationship in particular. In contrast to amorphous materials, the observed instabilities are generated at relatively low velocity, while at high velocity the crack path remains stable. No evidences for mirror, mist, and hackle instabilities, typical in amorphous materials, were found.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
