Fractal model of thermal contact conductance of rough surfaces considering substrate deformation

Abstract

PurposeThe purpose of this study is to propose a fractal model of thermal contact conductance (TCC) of rough surfaces considering substrate deformation. Three deformation modes of the asperity of the rough surface are considered, including elastic deformation, elastic–plastic deformation and full plastic deformation.Design/methodology/approachThe influences of contact load, fractal dimension and fractal roughness on the TCC of the rough surface were studied.FindingsThe results show that the TCC of the rough surface increases with the increase of contact load. When D > 2.5, the larger the fractal dimension, the higher the increased rate of the TCC of the rough surface with the increase of contact load. The TCC of the rough surface increases with the increase of fractal dimension and decreases with the increase of fractal roughness. The TCC of the rough surface can be achieved by selecting a contact surface with roughness.Originality/valueA fractal model of TCC of rough surfaces considering substrate deformation was established in this study. The achievements of this study provide some theoretical basis for the investigation of TCC of rough surfaces.