Abstract

Outsourced PCB fabrication necessitates increased hardware assurance capabilities. Several assurance techniques based on AOI have been proposed that leverage PCB images acquired using digital cameras. We review state-of-the-art AOI techniques and observe a strong, rapid trend toward ML solutions. These require significant amounts of labeled ground truth data, which is lacking in the publicly available PCB data space. We contribute the FPIC dataset to address this need. Additionally, we outline new hardware security methodologies enabled by our dataset.

Full Text
Published version (Free)

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call