Abstract
Progress of selected FPA (Focal Plane Array) technology development at Rockwell Scientific Company is reviewed: very large format monolithic visible CMOS, hybrid silicon pin visible CMOS, ultra high frame rate (360ns interframe time) burst mode camera, substrate removed HgCdTe infrared detectors for continuous visible through infrared spectral sensitivity, astronomical focal plane arrays, mosaic (16 megapixel) infrared FPAs, JWST, and the SIDECAR ASIC readout interface chip.
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