Abstract

Dark silicon refers to the phenomenon that a fraction of a many-core chip has to become “dark” or “dim” in order to guarantee the system to be kept in a safe temperature range and allowable power budget. Techniques have been developed to selectively activate non-adjacent cores on many-core chip to avoid temperature hotspot, while resulting unexpected increase of communication overhead due to the longer average distance between active cores, and in turn affecting application performance and energy efficiency, when Network-on-Chip (NoC) is used as a scalable communication subsystem. To address the brand-new challenges brought by dark silicon, in this paper, we present FoToNoC, a Folded Torus-like NoC, coupled with a hierarchical management strategy for heterogeneous many-core systems. On top of it, objectives of maximizing application performance, energy efficiency and chip reliability are isolated and well achieved by hardware-software co-design in several different phases, including application mapping and scheduling, cluster management and DVFS control. Evaluations on PARSEC benchmark applications demonstrate the significance of the entire strategy. Compared with state-of-the-art approaches, the proposed FoToNoC organization can achieve on average 35.4 and 35.2 percent on communication efficiency and application performance improvement, respectively, when maintaining the safe chip temperature. The hierarchical cluster-based management strategy can further reduce an average 34.6 percent of the total energy consumption with a notable reduction on the chip peak temperature. The significant achievements on system energy efficiency and the reduction on chip temperature of H.264 decoder and DSP-stone benchmarks additionally verify the effectiveness of the proposed methods.

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