Abstract

The main electrical parameters of fabricated Au/SrTiO3/n-Si (MFS) structures have been investigated by using various methods. The values of ideality factor (n) and zero-bias barrier height (ΦB0) are calculated from the forward bias current–voltage (IF–VF) data as 0.60, and 0.48 eV from thermionic theory (TE) and Cheung functions, respectively. The value of Rs is also obtained from the Norde function and Cheung functions as 87.83 and 137.57 Ω, respectively. The discrepancy between these results can be attributed to the calculated method and the measured voltage range. Besides, the energy density distribution profile of interface state (Nss) was obtained from the (IF–VF) data by taking into account voltage dependent barrier height (BH), n and without Rs. On the other hand, the possible current conduction mechanism (CCM) are determined by utilizing the In(IF) versus In(VF) and In(IR) versus VR1/2 plots. The double logarithmic IF–VF plot shows three linear regions which are corresponding to low, moderate and high bias voltages with different slopes (m) as 2.40, 1.96 and 1.27 respectively. While the first region space charge limited current (SCLC) is dominated, the other two regions ohmic behavior is dominated. The field-lowering coefficient (β) was also obtained from the slope of In(IR)–V1/2 plot as 4.40 $$\times$$ 10−6 eV−1 m1/2 V1/2. This value of β is close to theoretical value of Poole–Frenkel emission (PFE) rather than Schottky emission (SE) mechanism.

Full Text
Paper version not known

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call

Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.