Abstract

In recent years, resistive switching memory devices are attracted much attention for high-density non-volatile memory applications owing to their cell scalability, multilevel operations, and 3D capability in crossbar memory arrays. In this work, we report the forming-free and multilevel resistive switching properties of hydrothermally synthesized hexagonal molybdenum oxide (h-MoO3) microrods. The formation of h-MoO3 microrods was confirmed by using the X-ray diffraction technique and scanning electron microscopy. Different chemical properties of h-MoO3 microrods were determined by energy-dispersive X-ray, photoluminescence, Raman, and X-ray photoelectron spectroscopic techniques. The memory device was fabricated in a Ti/MoO3/FTO structure and its bipolar resistive switching properties were investigated. The memory device shows voltage-dependent tunable I-V properties and shows electroforming-free operation. Moreover, we have calculated the different memristive properties and showed that the device possesses double-valued charge-magnetic flux characteristics, suggesting the dominance of memristive properties in the Ti/MoO3/FTO device. We further explored the multilevel resistive switching property of the device by varying the RESET voltage. The Ti/MoO3/FTO memristive device can able to show four distinct resistive states during endurance and retention tests. The statistical analysis suggested that the device has less variation during the cycle-to-cycle operation. The device conduction mechanism was obtained by fitting different charge transport models, and a possible resistive switching mechanism is presented based on the observed multilevel resistive switching effect of the Ti/MoO3/FTO memristive device.

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