Forming of Dynamic Microstructure of Flexible Polymer.

Yung-Jin Weng

doi:10.3390/ma12203332

Abstract

This study focuses on the forming of dynamic microstructure of flexible polymer. The dynamic tensile control microstructure of the polymer mold, along with the gasbag, was used to exert pressure to achieve forming. This study simulated the dynamic control of the flexible mold, and proposed four mechanical models of material viscoelastic response for modeling and evaluation. MATLAB software was used to calculate the imprint prediction calculation theory construction according to the imprint result of curved surface and asymmetric imprint forming. This study designed and developed a gasbag-assisted dynamic forming system, and tested the proposed system for verification. The test results showed that the mechanical stability, curved surface, and asymmetric imprint prediction calculation of the mechanical model of the viscoelastic response of flexible mold material, as proposed in this study, can display the geometric features of the imprinted microstructure. The dynamic mold microstructure control process can accurately transfer a bifacial microstructure and construct the confidence interval for transfer printing forming.

Highlights

With the rapid advances in science and technology, continuous mass production is the future of industrial development, and system engineering follows the trend of microminiaturization
The mold material is usually used for fabricating accurate sized molds, where the microelectromechanical system (MEMS) technology is often used, while Mask, Photoresist, and Lithography technologies are used to fabricate microstructure components
As the MEMS technology can achieve forming of stable microstructure components, it has been widely used in the front end of line and middle end of line in the bulk production of most semiconductors

Summary

Introduction

With the rapid advances in science and technology, continuous mass production is the future of industrial development, and system engineering follows the trend of microminiaturization. The microelectromechanical system (MEMS) process technology [1–4] and semiconductor process technology [5–7] are critical in the mass production of microsystem components. They are both integrated with multiple technologies, and generally arranged according to multiple sequential processes, including the cleaning and surface preparation of wafer preprocesses, photoresist coating and baking, alignment exposure, development, etching (or ion implantation), etc., as the final process of creating micrographic components or micro molds. The silicon substrate is the main material, but the hard-brittle (fragile) silicon substrate may increase the defects in the microsystem structure components during bulk production, the fabrication process requires experts in the field. The model molding technology has developed rapidly in recent years, and the common microstructure component model molding technologies at present include plastics micro-injection molding [8,9], micro-thermoforming [10–12], Materials 2019, 12, 3332; doi:10.3390/ma12203332 www.mdpi.com/journal/materials

Methods

Results

Conclusion