Abstract
The microstructure formation at the interface in a copper-clad aluminum bimetallic wire has been investigated. Ultra-fine copper grains with sizes of 200 nm are formed near the Cu/Al interface when the wire is drawn after heat treatment. The formation of the ultra-fine copper grains is attributed to low-temperature recrystallization from strain that develops as the copper plastically flows around a broken dispersion of intermetallics at the interface. The ultra-fine copper grains added extra strength to the Cu/Al interface.
Full Text 
Sign-in/Register to access full text options
Sign-in/Register to access full text options 
Published version (
Free)
Free) 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a call
