Abstract
The variation in the structure and phase and chemical compositions over the section of the “titanium alloy–stainless steel” joint soldered with silver solder is investigated by scanning electron microscopy, microhardness tests, and X-ray structural and electron probe microanalyses. It is shown that the diffusion zone with the eutectoid-type structure (α + Ti2(AgCu) intermetallic compound) and microhardness characteristics close to PT3V parent metal is formed due to the interdiffusion of chemical elements entering the solder (Ag, Cu) and PT3V alloy (Ti, Al, V). A diffusion zone is formed on the side of stainless steel 18Cr10Ni1Ti. This zone has the following characteristics layers: the layer of the Ag–Cu solder depleted with copper and having particles of the TiAg intermetallic compound, the layer based on the Ti(CuFe) complex intermetallic compound, the layer based on the Ti(FeNi) complex intermetallic compound, the layer based on the Ti(Fe, Cr)2 complex intermetallic compound, the layer of the Ti5Cr8Fe16 ternary compound of a complex solubility, and the layer of steel depleted by chromium with the α + γ + σ three-phase structure. The presence of intermetallic compounds in the diffusion zone on the steel side promoted an increase in microhardness characteristics compared with parent metal 18Cr10Ni1Ti.
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