Abstract
When surfactants are present in polishing compositions severe damage is done to the initial crystal structure of a very thin (tenths and hundredths of a micron thick) surface layer of the material (silicon) being processed and the deformation-strength properties of the material change as a result of the Rebinder effect. The use of active additives in polishing compositions, including unconventional ones, makes it possible to decrease the thickness of the damaged layer by a factor of 1.5 – 2, significantly increasing the polishing efficiency in the process.
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