Abstract
Silicon wafers were implanted with 6 MeV oxygen ions. A 0.8 μm amorphous buried layer was formed at ≈4.0 μm from the surface. The top silicon layer remained monocrystalline, but with some damage. Upon annealing at 1300 °C for 6 h, a 0.2 μm nearly stoichiometric oxide layer is formed for specimens implanted with 8 × 1017 O2+ cm−2, thus confirming the thermodynamic aspect of oxide growth in SIMOX (separation by implantation of oxygen) structures. The annealing restores the crystal quality of the top silicon film up to 3.5 μm, but on both sides of the buried oxide layer, bands with a high density of twins are formed.
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