Formation of nanocrystalline structure of TaSi2 films on silicon

Abstract

The nanocrystalline structure and mechanical properties of TaSi2 films deposited by sputtering of TaSi2 target have been investigated by x-ray diffraction, cross-sectional transmission electron microscopy (TEM), four-point electrical resistance measurement, and cyclic depth-sensitive nanoindentation. The purpose of this work is to study the formation of nanocrystalline structure in TaSi2 films on a silicon substrate. As revealed, a decrease in the deposition rate leads to an increase in the O and C impurity content in the films. Contamination of the film by O and C atoms during a low-rate deposition causes the formation of an amorphous phase in the deposited films. Upon annealing, the amorphous structures crystallize into mixtures of disilicide and a small amount of polysilicide, i.e. TaSi2 and Ta5Si3, respectively. After annealing at 970 K, the formation of a nanocrystalline structure with a grain size about 10 nm takes place in the film produced at a deposition rate of 0.2 nm/sec. The formation of a nanocrystalline structure changes drastically the mechanical properties of the film. The nanohardness and elastic modulus increase significantly, and the film becomes brittle and overstressed. After deposition in the film produced at the 1 nm/sec deposition rate mainly Ta disilicide and the amorphous phase are observed. After annealing, the amorphous phase near the Si substrate coexists with column-shape grains of Ta disilicide of size 150 × 500 nm. The annealed thin film becomes nonuniform in thickness. The nanohardness and elastic modulus increase.