Abstract
The structural evolution of interfaces between the Sn–3.5Ag–0.9Zn–xAl (x = 0.5 and 1.0) solders and Cu substrate has been investigated by microstructural observations. The results suggest that the addition of Al in the Sn–3.5Ag–0.9Zn restrains the formation of Cu5Zn8 intermetallic compounds (IMCs) at the soldered interface. Moreover, the formation of Al2Cu and Cu9Al4 IMCs leads to a crack failure near the interface of the Sn–3.7Ag–0.9Zn–1Al and Cu pad. It is suggested that the increase of Al content (e.g. 1 wt%) in the Sn–Ag–Zn eutectic solder would do harm to the reliability of the solder joint.
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