Abstract

In the background of enhancing thermoelectric (TE) figure of merit of solid-state materials, the introduction of porous structure can significantly decrease lattice thermal conductivity by intensifying phonon scattering at the inhomogeneous microscale pores. Herein, we developed a porous structure in Cu0.07Bi0.5Sb1.5Te3 compounds by utilizing PVA as the pore former, and systematically studied its effect on thermoelectric properties. The results revealed that the reduction in thermal conductivity (~28%) was greater than the decrease in electrical conductivity (~17%) with increasing porosity, indicating long-wavelength phonon scattering was enhanced at micro-scale pores. Consequently, a peak zT of 1.342 at 400 K, and a zTavg of 1.254 in the temperature range of 300–500 K and an ηmax of ~9.4% at ΔT = 200 K were achieved in the porous sample (10.58%), which all are higher than that of dense sample. The hardness and compressive strength of the porous samples were significantly higher than commercial zone melting ingots. The proposed methodology is a cost-effective and efficient way of producing high-performance TE devices with good mechanical stability for real life practical applications.

Full Text
Published version (Free)

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call