Abstract
In recent years, with the miniaturization of electric devices, the demand for flexible printed circuits (FPCs) using polyimide has increased, because of its excellent heat resistance and size stability. Polyimide also has good flexibility and surface smoothness. However, polyimide absorbs moisture readily and is highly permeable to gas. In contrast, Cyclo Olefin Polymer (COP) has low moisture absorption, excellent size stability and excellent high frequency electrical properties. Therefore, COP is attractive as a substrate for FPCs. However, it is difficult to form a metal film using electroless plating on the COP with conventional processes. We could form a copper film with high adhesion strength while maintaining a smooth resin surface by modifying the surface using UV irradiation. Surface modification by UV irradiation was effective to achieve good adhesion (about 1.0 kN/m) between the COP resin and the deposited metal without roughening the COP surface. The interface electric conductivity of the printed circuit on COP produced by this method indicated a value of approximately 80% up to around 30 GHz.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callMore From: Transactions of The Japan Institute of Electronics Packaging
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
