Formation of embedded fine copper patterns in various resins by the transfer of plated metal patterns

Abstract

A combination of two techniques was used to form metal patterns embedded in flexible resin films. First, metal patterns were formed on sacrificial glass substrates using a photodefinable metal complex solution to form a latent catalyst image. Then, copper was selectively deposited on the catalyst image by electroless plating. In the first step, copper mesh patterns with ca. 90%T visible light transmittance and sheet resistance less than 1 Ω/□ were formed on glass substrates. In the next step, copper patterns were transferred by forming flexible thin resin films on sacrificial glass surfaces with the copper patterns, then curing the resin and delaminating the resin films from the glass. Height differences on the nanometre scale between the film surface and embedded copper pattern showed that complete embedding of the copper structures was attained. After the transfer, change in the optical and electrical properties of the mesh pattern was not detected.