Abstract
The study of the formation of the Cu6Sn5 intermetallic compound in Sn(55 nm)/Cu(30 nm) thin bilayer films was carried out directly in the column of a transmission electron microscope (electron diffraction mode) by heating the film sample from room temperature to 300oC and recording the electron diffraction patterns. The thin films formed as a result of a solid state reaction were monophase and consisted of the eta-Cu6Sn5 hexagonal phase. The temperature range for the formation of the eta-Cu6Sn5 phase was determined. The estimate of the effective interdiffusion coefficient of the reaction suggests that the main mechanism for the formation of the Cu6Sn5 intermetallic is diffusion along the grain boundaries and dislocations. Keywords: thin films, Cu6Sn5 intermetallic compound, transmission electron microscopy, electron diffraction.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
