Abstract
Galvanic contact formation of a Cu-Sn alloy layer was investigated using an ionic liquid, trimethyl-n-hexylammonium bis[(trifluoromethyl)sulfonyl]amide, as a solvent for an electrolytic bath. The use of the ionic liquid rendered it possible to raise the processing temperature beyond 100°C so as to form the alloy layers faster than in the case of an aqueous media. The layer obtained was silver-gray speculum metal, which is composed of Cu 6 Sn 5 , Cu 3 Sn, and Cu 10 Sn 3 intermetallic phases. The rate-determining step of the alloy formation was found to be the interdiffusion of Cu (i.e., substrate) and deposited Sn atoms with the activation energy of 58 kJ mol -1 .
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